Kyocera showcases quantum tech innovations at Quantum Effects 2024

Kyocera’s role in shaping quantum technologies

Kyocera is developing a range of ceramic packaging solutions and assembly options, offering excellent thermal management and hermetic solution, thereby facilitating stable and scalable qubits^*1. The company's diverse materials, including HTCC and LTCC multilayer ceramic substrates and AlN carriers, offer superior heat dissipation and plating options. This enables low magneticity and brazing material with low permeability, which are crucial for the development and functioning of quantum technologies.

Meeting connection requirements and ensuring quantum state stabilization

Kyocera’s packages offer a variety of connection solutions for 2nd assembly such as Pin Grid Array (PGA) packages, and Land Grid Array (LGA) packages. Kyocera offers die assembly service for wire bonding and flip chip technology. Kyocera also provides materials for hermetic sealing, including “Ceramic to Metal” and “Metal to Metal” brazing materials, along with vacuum sealing packaging to support the stabilization of the quantum state.

Saphire wafer: A game-changer

Kyocera's sapphire wafer, produced with superior crystallinity, is expected to result in lower dielectric loss and excellent thermal conductivity at ultra-low temperatures, marking a significant advancement in quantum technology.

Kyocera’s commitment to quantum technologies

With a firm commitment to shaping the future of quantum technologies, Kyocera continues to provide a range of customized solutions to meet the diverse requirements of different qubit technologies and their applications. Ceramic materials have been investigated for use in harsh environmental applications for several decades. We are confident that our cutting edge technology will support our customers' advancements in quantum technologies.

Overview: Kyocera at Quantum Effects