MEMS Sensors Packaging

Upgrade your specification and sensing performance with ceramic packaging solutions

High class and low cost ceramic technology

A thinner, smaller surface mount type leadless package or other customized design structure is available for MEMS which have an open air cavity structure or other specifications.

We offer a variety of packages to meet market demands and full support of high design technology to provide optimized packaging solutions for your requirements.

Features

3D design (air cavity type, hermetic sealing availabilities)
Small hysteresis (superior properties provide less mechanical stress with MEMS)
No deformation during assembly and use (easy to use and respect the performance of MEMS)
Wide range for package dimensions (miniaturization)
Non magnetic solution available